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TLP焊 TLP bonding英语短句 例句大全

时间:2018-10-25 15:59:56

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TLP焊 TLP bonding英语短句 例句大全

TLP焊,TLP bonding

1)TLP bondingTLP焊

1.Preparation and welding performance of amorphous interlayer alloys forTLP bondingTLP焊用非晶态中间层合金的制备及焊接性能

英文短句/例句

1.Preparation and welding performance of amorphous interlayer alloys for TLP bondingTLP焊用非晶态中间层合金的制备及焊接性能

2.The Research on Microstructural Evolution and Diffusing Behaviour during TLP Bonding Using Nickel-base Interlayer镍基中间层TLP焊接的组织转变与扩散行为研究

3.Research of Transient Liquid Phase Joining Machine for Oil-pipeline Welding;管道的瞬时液相扩散焊(TLP)焊机研究

4.Influence of Welding Temperature on Property of 10Cr9Mo1VNb Steel TLP Joint焊接温度对10Cr9Mo1VNb钢TLP接头性能的影响

5.Microstructure and Properties of TLP and TIG+MIG Joint of T91 Steel PipeT91钢管TLP与TIG+MIG焊接接头组织与性能

6.The Investigation of the Effect of TLP on Hepatocellualr Growth;TLP对肝脏细胞生长的影响作用研究

7.Study of TLP Bonding Technology and Property for Dssimilar Steel Tubes of 12Cr2MoV and TP304H12Cr2MoV/TP304H异种钢管TLP连接工艺与性能研究

8.Studies on TLP Bonding of Tungsten and Copper Alloy and Surface Metallization of Graphite;钨与铜合金的TLP连接及石墨表面金属化研究

9.Cloning and Prokaryotic Expression in E.coli of a Thaumatin-like Protein Gene from Wheat Inoculated with Puccinia Striiformis;小麦类甜蛋白TLP基因的克隆与原核表达

10.Study on Interface Characteristic and Bonding Process of TLP Diffusion Bonding Joints of Power Station Steel Tubes电站钢管TLP扩散连接界面特征与连接过程研究

11.Effect of Aging on Microstructure and Properties of TLP Holding Joint with T23 Heat-resistance Steel时效对T23耐热钢TLP连接接头组织与性能的影响

12.Effect of Bonding Temperature on the Microstructure and Properties of T91/12Cr2MoWVTiB Welded Joint连接温度对T91/12Cr2MoWVTiB TLP连接接头组织和性能的影响

13.Effect of Bonding Pressure on Transient Liquid Phase Bonding Process and Joint Properties of T91/12Cr2MoWVTiB连接压力对TLP连接T91/12Cr2MoWVTiB过程及接头性能的影响

14.Stress verification of a TLP under extreme wave environment极端环境条件下TLP平台的应力校核(英文)

15.Microstructure and Mechanical Properties of TLP Joint of 12Cr1MoV Steel with Different Bonding Temperature不同连接温度下12Cr1MoV钢TLP连接接头组织与性能变化研究

16.Effects of TLP Bonding on the Microstructure of a Ni-base Single Crystal Superalloy During Creep DeformationTLP连接对一种镍基单晶高温合金高温蠕变变形组织的影响

17.Effect of Different Holding Time on Microstructures and Properties of TLP Joint of T91/102 Steel不同保温时间对T91/102异种钢管TLP连接接头组织和性能的影响

18.Effects of TLP bonding temperature on the microstructurs and properties of T91 joint with two-step heating process等温温度对T91钢TLP双温连接接头组织性能的影响

相关短句/例句

TLP diffusion bondingTLP扩散焊

1.TLP diffusion bonding of the IC10 directional-solidfication superalloy was studied.对定向凝固高温合金IC10进行了TLP扩散焊,中间层合金为在母材成分基础上加入一定量的降熔元素B配制而成,研究了在1270℃不同保温时间下焊缝及母材组织的变化,并对焊缝及母材中γ′相的形状尺寸变化进行了分析。

3)TLP bondingTLP连接

1.TheTLP bonding was carried out at 1230℃ for 8 h in vacuum.采用Ni-Cr-B非晶中间层瞬间液相连接(Transient liquid phase bonding)一种镍基单晶高温合金DD98,TLP连接在1230℃,8h真空条件下进行。

4)TLP technologyTLP技术

5)TLPTLP平台

1.Stress verification of aTLP under extreme wave environment极端环境条件下TLP平台的应力校核(英文)

2.According to the parameters of the center of gravity and weight given in the report of"The General Configuration and Weight Control of New ConceptTLP in deep water",the analysis of intact stability and damaged stability are presented in this report.我们在前期的研究工作中,确定了新型深水TLP平台的主尺度、重量控制等参数,本研究根据这些参数对自由浮态下的TLP平台进行了完整稳性的计算分析,得到该平台均符合规范的结果。

6)TLP diffusion bondingTLP扩散连接

1.Effects of bonding parameters on the properties ofTLP diffusion bonding joints of Ti-22Al-25Nb O-phase alloy;连接参数对Ti-22Al-25Nb合金TLP扩散连接接头性能的影响

2.Dissymmetry ofTLP diffusion bonding of dissimilar materials;异种材料TLP扩散连接过程的非对称性

3.The experimental study onTLP diffusion bonding of SiC particle reinforced Al based composite and aluminium alloy is conducted,and the microstructures of TLP diffusion bond is observed using SEM(S530),and the concentration profiles of elements in the joint area are measured using EDS(Link Systems 860 Analyzer).采用TLP扩散连接方法对铝合金与SiC颗粒增强Al基复合材料进行了连接试验研究 ,应用扫描电镜和能谱分析技术对TLP连接接头进行了微观组织观察和接头区域各元素的浓度分布测试。

延伸阅读

[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]分子式:C16H16ClN3O3S分子量:365.5CAS号:26807-65-8性质:暂无制备方法:暂无用途:用于轻、中度原发性高血压。

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